Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling technique
نویسندگان
چکیده
0026-2714/$ see front matter 2013 Elsevier Ltd. All rights reserved. http://dx.doi.org/10.1016/j.microrel.2013.06.018 ⇑ Corresponding author. Address: PREM, Department of Mechanical Engineering, Hanyang University, 17, Haengdang-dong, Seondong-gu, Seoul 133-791, Republic of Korea. Tel.: +82 2 2220 0431; fax: +82 2 2292 3406. E-mail address: [email protected] (G. Jang). Yusuf Cinar , Jinwoo Jang , Gunhee Jang a,⇑, Seonsik Kim, Jaeseok Jang b
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ورودعنوان ژورنال:
- Microelectronics Reliability
دوره 53 شماره
صفحات -
تاریخ انتشار 2013